Dissection and Inspection (Part II)

Here's the busbar that brings ground to the modular output board:

I rather like the bus bar setup. The solder-only standoffs I'm less thrilled about.

The output board has a few Nichicon caps and two more Rubycons for additional filtering. It is labeled for the 550w unit and has the plugs for the 750w unit. It actually looks like OCZ might have been contemplating an even larger unit with six PCIe cables.

In charge of the various protections is this thing:

Unfortunately no datasheet is available, so I cannot tell you what protections actually exist.

Lastly a look at the main PCB's soldering:

It all looks quite good, I couldn't find any spots with too much or too little solder.

The bits of hand soldering are well done too. I did find a couple component leads that are longer than I'd like:

To be fair to OCZ you would have to get pretty staggeringly unlucky for these to short out, if they did it would be during manufacturing and the unit would fail during OCZ's testing. Still, shorter would be nice.

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