Thermaltake, an industry leader in computer chassis, thermal solutions, and power supply units, launches the Core X9 Snow Edition E-ATX cube case, a continuation of Thermaltake’s tradition of innovative design and edgy technology, particularly for liquid-cooling system cases. Featuring a cube design, the series offers endless stackable ability and expandability for enthusiasts to create massive liquid cooling systems for a single system, file server or even dual systems. Users can customize the chassis for the best viewing presentation with interchangeable window and I/O panel design. Delivering outstanding cooling performance with compatibility for extensive DIY/AIO LCS and overclocking components, the Core X Series further enhances the reputation Thermaltake enjoyed for its earlier air cooling units
Core X9 Snow Edition offers an expandable system allowing enthusiasts to incorporate externally-modular upgrades. When stacked together, the chassis opens up space to expand the liquid cooling system, the storage solutions, or even create dual systems, thereby enabling a dedicated top/bottom set-up for pure cooling. Also, the maximum radiator length supported is 600mm on the front side.
Remarkable Expansion
Designed for high-end gaming system compatibility, the Core X9 Snow Edition’s modular drive racks allow gamers to easily install up to six data storage devices, a dual expansion slot VGA of up to 590mm in length, and a tower CPU cooler as high as 250mm. Even with a high-wattage PSU stretching to 200mm in length, it still leaves plenty of space for cable management. Moreover, two 480mm radiators can be installed on top of the chassis, delivering superior cooling performance.
Excellent Ventilation
The Core X9 Snow Edition’s unparalleled cooling ability offers fan brackets with various mounting points to support any type of gaming system that can be accommodated, including DIY/AIO liquid-cooling systems and air-cooling units. A large 200mm fan is pre-installed on the front side and a rear 120mm fan reassures and guarantees the flow of aeration. The fan brackets can either be adjusted for 120mm, 140mm, or 200mm fans on the top panel, while there is room for 120mm and 140mm fans on the side panel.
Chambers Concept
The upper chamber is made for cooling performance and better efficiency, while the lower one is made for PSU and drive bays. Thanks to the removable 2.5”/3.5” drive device racks, there is plenty of flexibility to gain the maximum interior space when needed for advanced cooling performance or liquid systems build.
Fully Modular Design
A “3 +9” drive bay concept design for accessory and storage devices makes setting up the best storage solution on the market super easy and flexible. In addition, a customizable 5.25” & 3.5” drive bay feature enables users to freely interchange the 3.5” hard-drive cages to suit their particular needs.
Interchangeable Window and I/O Panel
Users can customize the chassis for the best viewing presentation with an interchangeable window and I/O panel design. Located on the side are four USB 3.0 I/O ports.
Source: Thermaltake
