During the first day of the Snapdragon Tech Summit Digital, Qualcomm Incorporated President, Cristiano Amon took the virtual stage with global industry leaders to highlight...
MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7 nm SoC designed to bring advanced 5G capabilities and experiences to the mass...
Micron Technology, Inc., today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Now ready...
Lenovo™ is very excited to unveil the latest addition to our premium X1 portfolio, ThinkPad™ X1 Nano. The lightest ThinkPad ever at just 1.99 pounds...
Qualcomm Technologies, Inc. announced a new 5G mobile platform in the 7-series, the Qualcomm Snapdragon 750G 5G Mobile Platform, which enables truly global 5G with...
Qualcomm Technologies, Inc. today announced at Internationale Funkausstellung (IFA) Berlin the Qualcomm Snapdragon 8cx Gen 2 5G compute platform, the company’s most advanced and efficient...
MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Dimensity series family. The 7 nm Dimensity 800U chipset...
MediaTek today announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones. The Dimensity 720,...
Qualcomm Technologies, Inc. unveiled the Qualcomm Snapdragon 865 Plus 5G Mobile Platform, a follow-on to the flagship Snapdragon 865 that has powered more than 140...
HTC VIVE, a global leader in innovative technology, today officially announces it will enter the cloud software business with the VIVE XR Suite offering at...